Ôõô°ìÀíÎÞÏß²úÆ·ÈÕ±¾TELECÈÏÖ¤
ä¯ÀÀÁ¿£º1117 ±à¼£ºadmin À´Ô´£º»¥ÁªÍøÉÏ´«¸üУº2019-12-21
ÎÞÏß²úÆ·È磺ÎÞÈË»ú¡¢VRÑÛ¾µ¡¢ÖÇÄÜÑÛ¾µ¡¢ÖÇÄÜ»úÆ÷ÈË¡¢ÖÇÄÜÖ÷»ú¡¢ÖÇÄÜÊÖ±í¡¢ÖÇÄÜÉãÏñÍ·¡¢Ô˶¯×·×ÙÆ÷¡¢ÖÇÄܼҾӡ¢DIYµçÄÔ¡¢ÖÇÄܺóÊÓ¾µ¡¢ÖÇÄÜÐгµ¼Ç¼ÒÇ¡¢ÖÇÄÜÊÖ»ú¡¢ÖÇÄÜƽ°å¡¢±Ê¼Ç±¾¡¢ÓÎÏ·±¾¡¢À¶ÑÀÊÖ±í¡¢À¶ÑÀÒôÏä¡¢À¶ÑÀ¶ú»ú¡¢ÎÞÏß·ÓÉÆ÷¡¢ÎÞÏß²¥·ÅÆ÷¡¢ÎÞÏßͶӰ¡¢Ñ§Éúƽ°å¡¢Â¼Òô±ÊµÈ¶¼ÐèÒª°ìÀíTELECÈÏÖ¤¡£
ÓÉÓÚ²úÆ·ÊýÁ¿Ã¿ÈÕ¶¼ÔÚ¸üУ¬ËùÒÔÎÞ·¨ÖðÒ»Áгö£¬Èç¹û²»Çå³þ×Ô¼ºµÄ²úÆ·ÊÇ·ñÐèÒª°ìÀíTELECÈÏÖ¤£¬»¶ÓÀ´µç×Éѯ¡£
MIC¾ÍÊÇÈÕ±¾¾t„ÕÊ¡£¨¤½¤¦¤à¤·¤ç¤¦£©£¬£¨Ó¢ÎÄÈ«³ÆMinistry of Internal Affairs and Communications£¬¼ò³ÆMIC£©°ä²¼µÄ¡¶ëŠ²¨·¨¡·¤Ç¤ó¤Ñ¤Û¤¦ºÍ¡¶ëŠšÝͨÐÅʘI·¨¡·¤Ç¤ó¤¤Ä¤¦¤·¤ó¤¸¤®¤ç¤¦¤Û¤¦ÎªÒÀ¾Ý½øÐеÄÈÏÖ¤¡£
ʲôÊÇTELEC£¿
TelecµÄÈ«³ÆÊÇ£ºÒ»°ãØ”‡â·¨È˥ƥ쥳¥à¥¨¥ó¥¸¥Ë¥¢¥ê¥ó¥°¥»¥ó¥¿©`£¨Telecom Engineering Center£©£¬
¡¶ÎÞÏߵ編¡·ÒªÇ󣬶ÔÖ¸¶¨µÄÎÞÏßµçÉ豸½øÐÐÐͺźË×¼£¨¼´¼¼Êõ·¨¹æ·ûºÏÐÔÈÏÖ¤£©¡£ÈÏÖ¤ÊÇÇ¿ÖÆÐԵģ¬ÈÏÖ¤»ú¹¹ÎªMICÔÚÖ¸¶¨ÎÞÏßµçÉ豸·¶Î§ÈϿɵÄ×¢²áÈÏÖ¤»ú¹¹¡£TELEC£¨Telecom Engineering Center£©ÊÇÈÕ±¾ÎÞÏßµçÉ豸·ûºÏÐÔÈÏÖ¤µÄÖ÷ÒªµÄ×¢²áÈÏÖ¤»ú¹¹¡£ÓÐЩÀàËÆÓÚ¹úÄÚµÄSRRCÈÏÖ¤¡£Æä×ñѵÄÊÇÈÕ±¾µÄµç²¨·¨¡£
ÈÕ±¾TELECÈÏÖ¤ÉêÇëÁ÷³Ì
£¨1£©¿Í»§£ºµÝ½»ÉêÇë±íµ½ÊµÑéÊÒ£¬×¼±¸ÑùÆ·£¬Ç©¶©ºÏͬ²¢Ö§¸¶Ô¤¸¶¿î¡£
£¨2£©¼ì²âʵÑéÊÒ£º²âÊÔ²¢³ö±¨¸æ£¬³õ²½ÉóºË×ÊÁÏ£¬Ê±¼ä£º2ÖÜ¡£
£¨3£©ÈÕ±¾ÊÚȨ·¢Ö¤»ú¹¹£º×îÖÕÉóºË¡¢Ï·¢²Ý¸åؼ·¢Ö¤£¬¿Í»§Ö§¸¶Î²¿î¡£Ê±¼ä£º1-2ÖÜ¡£
ÈÕ±¾TELECÈÏÖ¤ËùÐè×ÊÁÏ
1.µç·ÔÀíͼSchematics
2.µç·×ßÏßͼPCB Layout
3.µç·ԪÆ÷¼þλºÅͼPCB component placement
4.·½¿òͼ£¨Ó¢ÎÄ£©Block Diagram
5.RFµç·¹¤×÷ÔÀíÃèÊö RF circuit Operating Description
6.Ó¢ÎÄ˵Ã÷Êé User Manual
7.µç×ÓÔªÆ÷¼þÇåµ¥BOM
8.ÌìÏßÔöÒæ²âÊÔ±¨¸æAntenna gain test report
9.ÉêÇëÉ̺ÍÖÆÔìÉ̵ÄISO9001Ö¤Êé ISO certificate for applicant and manufacture
10.ÈçÎÞ·¨Ìṩ£¬ÔòÐèҪǩÏàÓ¦µÄÉùÃ÷ÐÅ
ÇëÌṩÉêÇëÉ̺ÍÖÆÔìÉ̵Ĺ«Ë¾ÁªÏµÈË(CEO»òÕßÊÇPresident)Ó¢ÎÄÃûÈ«³Æ£¬µç×ÓÇ©Ãû£¬Ö°Î»Í·ÏΣ¬µç»°£¬´«Õ棬µç×ÓÓʼþ
ÎÄÕÂÒýÓ㺠Ôõô°ìÀíÎÞÏß²úÆ·ÈÕ±¾TELECÈÏÖ¤ /info/203.html
±¾ÎÄÕª×Ô»¥ÁªÍø»òÕßÐÐÒµÏà¹ØµÄÔÓÖ¾£¬±¨Ö½£¬Êé¼®µÈ×ÊÁÏ£¬ÈçÓаæȨ¾À·×£¬ÇëÁªÏµ¿·¢app¹ÙÍøµÇ¼¼´¿Éɾ³ý£¬¿·¢app¹ÙÍøµÇ¼»¶ÓÄú·ÖÏí£¬±¾ÎIJ»ÔÊÐí¸´ÖƳϮ
¿·¢k8¹ú¼Ê¡ª¡ª»¥ÁªÍø¼ì²â´óƽ̨,רҵ´ÓÊ£º3CÈÏÖ¤ £¬CEÈÏÖ¤ £¬CQCÈÏÖ¤ £¬ULÈÏÖ¤ £¬SRRCÈÏÖ¤ £¬FCCÈÏÖ¤ £¬ISO9000ÈÏÖ¤ £¬¼ì²âÈÏÖ¤ £¬RohsÈÏÖ¤ £¬»¶ÓÄúµÇ½¿·¢app¹ÙÍøµÇ¼¹ÙÍø /
ÎÞÏß²úÆ·È磺ÎÞÈË»ú¡¢VRÑÛ¾µ¡¢ÖÇÄÜÑÛ¾µ¡¢ÖÇÄÜ»úÆ÷ÈË¡¢ÖÇÄÜÖ÷»ú¡¢ÖÇÄÜÊÖ±í¡¢ÖÇÄÜÉãÏñÍ·¡¢Ô˶¯×·×ÙÆ÷¡¢ÖÇÄܼҾӡ¢DIYµçÄÔ¡¢ÖÇÄܺóÊÓ¾µ¡¢ÖÇÄÜÐгµ¼Ç¼ÒÇ¡¢ÖÇÄÜÊÖ»ú¡¢ÖÇÄÜƽ°å¡¢±Ê¼Ç±¾¡¢ÓÎÏ·±¾¡¢À¶ÑÀÊÖ±í¡¢À¶ÑÀÒôÏä¡¢À¶ÑÀ¶ú»ú¡¢ÎÞÏß·ÓÉÆ÷¡¢ÎÞÏß²¥·ÅÆ÷¡¢ÎÞÏßͶӰ¡¢Ñ§Éúƽ°å¡¢Â¼Òô±ÊµÈ¶¼ÐèÒª°ìÀíTELECÈÏÖ¤¡£
ÓÉÓÚ²úÆ·ÊýÁ¿Ã¿ÈÕ¶¼ÔÚ¸üУ¬ËùÒÔÎÞ·¨ÖðÒ»Áгö£¬Èç¹û²»Çå³þ×Ô¼ºµÄ²úÆ·ÊÇ·ñÐèÒª°ìÀíTELECÈÏÖ¤£¬»¶ÓÀ´µç×Éѯ¡£
MIC¾ÍÊÇÈÕ±¾¾t„ÕÊ¡£¨¤½¤¦¤à¤·¤ç¤¦£©£¬£¨Ó¢ÎÄÈ«³ÆMinistry of Internal Affairs and Communications£¬¼ò³ÆMIC£©°ä²¼µÄ¡¶ëŠ²¨·¨¡·¤Ç¤ó¤Ñ¤Û¤¦ºÍ¡¶ëŠšÝͨÐÅʘI·¨¡·¤Ç¤ó¤¤Ä¤¦¤·¤ó¤¸¤®¤ç¤¦¤Û¤¦ÎªÒÀ¾Ý½øÐеÄÈÏÖ¤¡£
ʲôÊÇTELEC£¿
TelecµÄÈ«³ÆÊÇ£ºÒ»°ãØ”‡â·¨È˥ƥ쥳¥à¥¨¥ó¥¸¥Ë¥¢¥ê¥ó¥°¥»¥ó¥¿©`£¨Telecom Engineering Center£©£¬
¡¶ÎÞÏߵ編¡·ÒªÇ󣬶ÔÖ¸¶¨µÄÎÞÏßµçÉ豸½øÐÐÐͺźË×¼£¨¼´¼¼Êõ·¨¹æ·ûºÏÐÔÈÏÖ¤£©¡£ÈÏÖ¤ÊÇÇ¿ÖÆÐԵģ¬ÈÏÖ¤»ú¹¹ÎªMICÔÚÖ¸¶¨ÎÞÏßµçÉ豸·¶Î§ÈϿɵÄ×¢²áÈÏÖ¤»ú¹¹¡£TELEC£¨Telecom Engineering Center£©ÊÇÈÕ±¾ÎÞÏßµçÉ豸·ûºÏÐÔÈÏÖ¤µÄÖ÷ÒªµÄ×¢²áÈÏÖ¤»ú¹¹¡£ÓÐЩÀàËÆÓÚ¹úÄÚµÄSRRCÈÏÖ¤¡£Æä×ñѵÄÊÇÈÕ±¾µÄµç²¨·¨¡£
ÈÕ±¾TELECÈÏÖ¤ÉêÇëÁ÷³Ì
£¨1£©¿Í»§£ºµÝ½»ÉêÇë±íµ½ÊµÑéÊÒ£¬×¼±¸ÑùÆ·£¬Ç©¶©ºÏͬ²¢Ö§¸¶Ô¤¸¶¿î¡£
£¨2£©¼ì²âʵÑéÊÒ£º²âÊÔ²¢³ö±¨¸æ£¬³õ²½ÉóºË×ÊÁÏ£¬Ê±¼ä£º2ÖÜ¡£
£¨3£©ÈÕ±¾ÊÚȨ·¢Ö¤»ú¹¹£º×îÖÕÉóºË¡¢Ï·¢²Ý¸åؼ·¢Ö¤£¬¿Í»§Ö§¸¶Î²¿î¡£Ê±¼ä£º1-2ÖÜ¡£
ÈÕ±¾TELECÈÏÖ¤ËùÐè×ÊÁÏ
1.µç·ÔÀíͼSchematics
2.µç·×ßÏßͼPCB Layout
3.µç·ԪÆ÷¼þλºÅͼPCB component placement
4.·½¿òͼ£¨Ó¢ÎÄ£©Block Diagram
5.RFµç·¹¤×÷ÔÀíÃèÊö RF circuit Operating Description
6.Ó¢ÎÄ˵Ã÷Êé User Manual
7.µç×ÓÔªÆ÷¼þÇåµ¥BOM
8.ÌìÏßÔöÒæ²âÊÔ±¨¸æAntenna gain test report
9.ÉêÇëÉ̺ÍÖÆÔìÉ̵ÄISO9001Ö¤Êé ISO certificate for applicant and manufacture
10.ÈçÎÞ·¨Ìṩ£¬ÔòÐèҪǩÏàÓ¦µÄÉùÃ÷ÐÅ
ÇëÌṩÉêÇëÉ̺ÍÖÆÔìÉ̵Ĺ«Ë¾ÁªÏµÈË(CEO»òÕßÊÇPresident)Ó¢ÎÄÃûÈ«³Æ£¬µç×ÓÇ©Ãû£¬Ö°Î»Í·ÏΣ¬µç»°£¬´«Õ棬µç×ÓÓʼþ
±¾ÎÄÕª×Ô»¥ÁªÍø»òÕßÐÐÒµÏà¹ØµÄÔÓÖ¾£¬±¨Ö½£¬Êé¼®µÈ×ÊÁÏ£¬ÈçÓаæȨ¾À·×£¬ÇëÁªÏµ¿·¢app¹ÙÍøµÇ¼¼´¿Éɾ³ý£¬¿·¢app¹ÙÍøµÇ¼»¶ÓÄú·ÖÏí£¬±¾ÎIJ»ÔÊÐí¸´ÖƳϮ
¿·¢k8¹ú¼Ê¡ª¡ª»¥ÁªÍø¼ì²â´óƽ̨,רҵ´ÓÊ£º3CÈÏÖ¤ £¬CEÈÏÖ¤ £¬CQCÈÏÖ¤ £¬ULÈÏÖ¤ £¬SRRCÈÏÖ¤ £¬FCCÈÏÖ¤ £¬ISO9000ÈÏÖ¤ £¬¼ì²âÈÏÖ¤ £¬RohsÈÏÖ¤ £¬»¶ÓÄúµÇ½¿·¢app¹ÙÍøµÇ¼¹ÙÍø /